Resin Sealant Glue AB Glue Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting Casting Encapsulation
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Item Name
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Casting Resin
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Sample
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Free of Charge
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Advantage
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Safety and Environmental Compliance.
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Second-Level Curing
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Cures within 1-15 seconds after application, significantly shortening production cycles and making it ideal for high-speed automated production lines.
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Usage
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Electronics Industry: Encapsulates circuit boards, sensors, connectors, etc., preventing moisture ingress and mechanical impact.
Automotive Industry: Protects critical electronic components like engine control units and safety systems, withstanding extreme temperatures and vibrations. Industrial Electronics: Encapsulates industrial sensors, control units, and power modules to resist dust, moisture, and chemicals.
New Energy Sector: Used in new energy vehicle control units (VCU) and 5G base station power modules, providing high thermal conductivity (2.2 W/m·K) and insulation protection.
Aerospace: Encapsulates avionics, navigation
systems, and communication equipment to withstand extreme temperature fluctuations and mechanical stress. |
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Function
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High Strength and Hardness, Low Shrinkage Rate: Curing shrinkage rate below 0.5%, high insulation strength, high resistivity, stable dielectric constant, wide temperature tolerance range, chemical corrosion resistance, withstands erosion from acids, alkalis, organic solvents, and other chemicals.
Moisture, Water, and Dust Resistance: Forms a dense protective layer to block moisture, water, and dust.
Aging Resistance: Passes accelerated aging test at 85°C/85%RH for 1000 hours with insulation resistance retention exceeding 90%, ensuring a service life exceeding 10 years.
Abrasion and Impact Resistance: Cured material exhibits excellent abrasion resistance and impact strength exceeding 5.1 Kgf/mm, suitable for vibrating environments.
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Model
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HLP – 5000
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HLP – 5500
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HLP – 5510
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HLP – 5800
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Proportion
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A:B=1:1
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A:B=10:1
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A:B=1:1
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A:B=1:1
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Appearance
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Transparent/Red/Black/White/Green/Gray/
Custom Other
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Black/White/
Transparent
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Viscosity
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1500 to 2000 cps, 25°c
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A:3500 to 4500 cps, 25°c
B:5-10 cps, 25°c
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Hardness
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80D
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25A
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65A
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Thermal Conductivity
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0.7 to 0.8w/m’k
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0.3w/m’k
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0.8w/m’k
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0.3w/m’k
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Operating Temperature
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-50° to 130°c
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-60° to 200°c
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-60° to 250°c
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-70° to 130°c
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Initial Set Time
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4 to 8h (25°c)
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3 to 8h (25°c)
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3 to 5h (25°c)Â
1h (80°c)
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3 to 4h (25°c)
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Full Cure Time
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24h (25°c)
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24h (25°c)
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24h (25°c)
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24h (25°c)
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Dielectric Strength
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18 to 21kv/mm
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25kv/mm
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27kv/mm
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20kv/mm
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Shrinkage Rate
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＜0.5%
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＜0.1%
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＜0.1%
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＜0.3%
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Waterproof Rating
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IP68
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IP68
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IP68
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IP68
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Electronics Industry PCB and Sensor Protection: Encapsulates circuit boards, sensors, connectors, solar panels, and other components to prevent moisture ingress and mechanical impact, enhancing durability. For instance, in LED driver power supplies, potting compounds shield components from humidity and dust while improving thermal dissipation efficiency. Power Module Encapsulation: Used in 5G base station power modules, new energy vehicle control units (VCU), etc., providing high thermal conductivity (2.2 W/m·K) and insulation protection to ensure stable operation in high-temperature environments. Automotive Industry Electronic System Protection: Shields critical electronic components like engine control units, safety systems, and infotainment systems against extreme temperatures, vibration, and chemical corrosion. For instance, in automotive ignition coils, potting compounds prevent coil loosening due to vibration while enhancing insulation performance.
Industrial Electronics Sensor and Control Unit Protection: Encapsulates industrial sensors, control units, and power modules to resist dust, moisture, and chemicals, maintaining equipment functionality and safety. For instance, in factory automation equipment, potting compounds shield circuit boards from oil contamination and metal dust erosion. Aerospace and Defense Extreme Environment Adaptation: Protects avionics, navigation systems, and communication equipment against extreme temperature fluctuations, mechanical stress, and radiation exposure. For instance, in satellite electronics, potting compounds ensure equipment operates reliably under vacuum and extreme temperatures.
Medical Devices Imaging and Diagnostic Equipment Protection: Provides insulation and shielding for medical electronics—including imaging, diagnostic, and implantable devices—against bodily fluids, sterilization processes, and mechanical stress. For instance, in pacemakers, potting compounds isolate electronic components from human tissue while maintaining biocompatibility. LED Lighting LED Chip Protection and Thermal Management: Encapsulates LED chips to deliver optimal optical performance and thermal management while resisting environmental impacts. For example, in outdoor LED displays, potting compounds prevent moisture-induced short circuits in chips while enhancing heat dissipation efficiency and extending service life.
Transformers and Capacitors Insulation and Cooling: During transformer and capacitor manufacturing, potting compounds provide insulation and cooling effects, preventing component overheating and improving electrical performance. For instance, in high-voltage transformers, potting compounds fill coil gaps to reduce corona discharge and localized overheating.